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台湾产千住锡膏

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产品名称: 台湾产千住锡膏
产品型号: M705-S101HF-S4
产品展商: 千住金属
产品文档: 无相关文档

简单先容

锡96.5、银3.0、铜0.5###熔点:217-220℃###190±20Pa.s###230-260℃###要求无卤素的复杂电子产品制造###0-10℃

台湾产千住锡膏  的详细先容
台湾产千住锡膏
台湾产千住锡膏 ECO SOLDER PASTE M705-S101HF-S4
1.Scope
This specification covers the solder paste,
ECO SOLDER PASTE M705-S101-S4, using lead-free solder alloy, used for
wiring connection and so on, of electrical and electronic parts.
2.Standard
２.1Chemical composition of solder alloy（Test method：STM-9）
Composition and impurities are prescribed as following tables
Composition ( mass% )
Ａｇ
Ｃｕ
Ｓｎ
3.0 ± 0.1
0.50 ± 0.05
Balance
2.2Performance and standard
Items
Performance                 Standard
Test Method
Appearance
It shall not have separated flux,and shall be in a smooth pastestate.
STM-1
 
Flux content (mass%)
11.5 ± 1.0
STM-5
Viscosity of solderpaste (Pa s)
190 ± 30
STM-7-8
Grain size of powder
（um）
36 ～25
STM-12-4
Copper plate corrosion test
Shall be passed
STM-28-1
Insulation resistance
Ordinary state 1 × 10 or more After humidifying 1 × 10 or more
STM-30-8
Solution resistance
100 or more
STM-32
Reflow property
No unmelted solder nor black product shall be permissibl
STM-34
 
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